Table of Contents
HPE introduces a density-optimized, scale-out system to meet the changing demands of your workloads in HPC and enterprise data centers.
HPE Cray XD2000 System is a dense, multi-server platform that packs incredible performance and workload flexibility into a small data center space, while delivering the efficiencies of a shared infrastructure.
It is a 2U chassis system that supports up to 4 half-wide 1U 2P Nodes or 2 half-wide 2U 2P Nodes. Each of the servers can be serviced without impacting operation of other servers in the same chassis, increasing server up-time. It delivers up to 4 times the density of a traditional rack mount 2U server in standard racks and provides rear-aisle serviceability access.
Overview
HPE Cray XD2000 delivers a complete HPC solution from chassis-scale to rack-scale, in a rack-and-roll fashion. It offers a complete, scalable solution for HPC customers everywhere, with flexibility of right-sized power and cooling options, including Direct Liquid Cooling and ensures maximum performance at the lowest possible total cost of ownership.
Built with Exascale-ready networking technologies, integrated storage, extensive software portfolio and management tools, HPE Cray XD2000 systems can enable customers to innovate and prepare for tomorrow’s challenges.
Chassis
The HPE Cray v2240 / v2277 chassis occupies 2U space in the rack.
- – HPE Cray v2240 Chassis—This model supports 240 V power supplies
- – HPE Cray v2277 Chassis—This model supports 277 V power supplies for the specific request in NA.
Server Node
- – HPE Cray XD220v Server—1U, dual-processor Intel® server Node
- – HPE Cray XD225v Server—1U, dual-processor AMD server Node
- – HPE Cray XD295v Server—2U, dual-processor AMD server Node
What’s New
- – Support for 5th Generation Intel® Xeon® Scalable Processors
- Support for up to 16 DDR5 5600 MT/s DIMMs per 1 server
- – Support for 5th Generation AMD EPYC™ Processors
- Support for up to 24 DDR5 6400 MT/s DIMMs per 1 server
- – PCIe 5.0 - doubling the data transfer speed of PCIe 4.0, giving faster data transfer speeds for SSDs, GPUs, and other peripheral cards
- – New HPE Cray XD295v server, which is a 2U variant of 1U XD225v server, supporting GPUs or extra PCIe slots for the first time on AMD based 2000 System
- – Direct Liquid Cooling (DLC) option for HPE Cray XD2000 System comes ready to plug and play. Choose from either CPU only or CPU plus memory cooling options
- – Up to four 2400 W Common Redundant Power Supplies, providing 9,600 W of power in a single chassis
- – Slingshot 11, InfiniBand NDR, and standard Ethernet, providing a choice of HPC interconnect technologies
- – New HPE Cray XD BMC offering Hardware Root of Trust with recovery and chain of trust, ensuring customers have firmware that is never compromised
Chassis Information
Form Factor
- – 2U
There are two chassis options with different voltages
- – HPE Cray v2240 CTO chassis – supports 240 V power supplies
- 240 VAC, 2400 W power supplies
- – HPE Cray v2277 CTO chassis – supports 277 V power supplies for specific customer request in North America region
- 277 VAC, 1600 W power supplies
Each HPE Cray XD2000 Chassis is built with the following
- – Four server slots for 1U Node or Two server slots for 2U Node
- – Supports up to four (4) power supplies for the chassis
- Minimum of two (2) power supplies required; PSU bezel blanks go into unused PSU slots
- – Two backplanes each with 4SFF U.2 NVMe drives
- – Two drives bezel blanks for no drives configured chassis
Server Tray Blank Kit
A chassis requires that four (4) server tray slots be populated with an HPE Cray XD220v/XD225v or an HPE Cray XD2000 Server Node Blank Kit.
Server Tray
HPE Cray XD220v server
- – 2P/1U half width server tray built on the 5th or 4th Generation Intel® Xeon® Scalable Processors. With choices from 32-64 cores, up to 2.8 GHz base and 4.1 GHz turbo CPU speed and power ratings up to 385 W (Supports air cooling for 350 W CPUs)
- – XD220v has 16 memory channels per server and supports 5600 MT/s memory, two PCIe Gen5 slots, and multiple networking options including high speed fabric.
- – Optional M.2 Mezz Riser Kit
- – 1 network port, 1 management port
- – Up to 4 server trays are supported per chassis
HPE Cray XD225v server
- – 2P/1U half width server tray built on the AMD EPYC™ 9005 or 9004 Series Processors. With choices from 16-128 cores, up to 3.65 GHz base and 5.0+GHz turbo CPU speed and power ratings up to 400 W (Some CPUs might require DLC)
- – XD225v has 24 memory channels per server and supports 6400 MT/s memory, two PCIe Gen5 slots, and multiple networking options including high speed fabric.
- – Optional M.2 Mezz Riser Kit
- – 1 network port, 1 management port
- – Up to 4 server trays are supported per chassis
HPE Cray XD295v server
- – 2P/2U half width server tray built on the AMD EPYC™ 9005 or 9004 Series Processors. With choices from 16-128 cores, up to 3.65 GHz base and 5.0+GHz turbo CPU speed and power ratings up to 400 W (Some CPUs might require DLC)
- – XD225v has 24 memory channels per server and supports 6400 MT/s memory, two PCIe Gen5 slots, and multiple networking options including high speed fabric.
- – 2 Double Wide FHFL GPUs or 2 Low Profile PCIe 5.0 cards
- – Optional M.2 Mezz Riser Kit
- – 1 network port, 1 management port
- – Up to two server trays per 2U chassis
- – Support for PCIe GPUs
Supported storage options: 0 or up to 2 SFF NVMe drives per 1U Node or up to 4 drives per 2U Node.
XD225v and XD295v can be mixed in a chassis. No mixing of Intel and AMD Nodes in a chassis.
Rack Airflow Requirements
HPE Cray XD2000 System
The increasing power of new high-performance processor technology requires increased cooling efficiency for rack-mounted servers. For maximum cooling, HPE racks are recommended to allow these racks to be fully loaded with servers using the latest processors. For detail information please see HPE Cray XD2000 System User Guide:
https://support.HPE.com/connect/s/search?language=en_US#q=XD2000
Notes:
– If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and to prevent damage to the equipment.
– When selecting Direct Liquid Cooling (DLC), HPE racks are required for factory integration.
– Always use blanking panels to fill all remaining empty front panel U-spaces in the rack. This arrangement ensures proper airflow. Using a rack without blanking panels will result in improper cooling that can lead to thermal damage.
Standard Features
Processors (up to 2 of the following depending on the model)
Notes:
– All Intel® Xeon® processors can support up to 2 TB of memory each on the HPE Cray XD2000 system
– All AMD EPYC™ processors can support up to 3 TB of memory each on the HPE Cray XD2000 system
– Certain limitations may apply to select processors, please contact your HPE sales representative
– Please contact your HPE sales representatives for any questions on processor support needed
– Some processors may require selection of Direct Liquid cooling options
| 5th Gen AMD EPYC™ Processor | Cores | Base Frequency | Max Frequency | Max Memory | Default TDP (W) | Cache | Memory |
|---|---|---|---|---|---|---|---|
| EPYC 9655 | 96 | 2.6 GHz | 4.5 GHz | 3 TB | 400 | 384 MB | 6400 MT/s |
| EPYC 9655P | 96 | 2.6 GHz | 4.5 GHz | 3 TB | 400 | 384 MB | 6400 MT/s |
| EPYC 9575F | 64 | 3.3 GHz | 5.0 GHz | 3 TB | 400 | 256 MB | 6400 MT/s |
| EPYC 9555 | 64 | 3.2 GHz | 4.4 GHz | 3 TB | 360 | 256 MB | 6400 MT/s |
| EPYC 9555P | 64 | 3.2 GHz | 4.4 GHz | 3 TB | 360 | 256 MB | 6400 MT/s |
| EPYC 9355 | 32 | 3.55 GHz | 4.4 GHz | 3 TB | 280 | 256 MB | 6400 MT/s |
| EPYC 9355P | 32 | 3.55 GHz | 4.4 GHz | 3 TB | 280 | 256 MB | 6400 MT/s |
| EPYC 9135 | 16 | 3.65 GHz | 4.3 GHz | 3 TB | 200 | 64 MB | 6400 MT/s |
| EPYC9845 | 160 | 2.1 GHz | 3.7 GHz | 3 TB | 400 | 320 MB | 6400 MT/s |
| EPYC9745 | 128 | 2.4 GHz | 3.7 GHz | 3 TB | 400 | 256 MB | 6400 MT/s |
| EPYC9535 | 64 | 2.4 GHz | 4.3 GHz | 3 TB | 300 | 256 MB | 6400 MT/s |
| EPYC9475F | 48 | 3.65 GHz | 4.8 GHz | 3 TB | 400 | 256 MB | 6400 MT/s |
| EPYC9455P | 48 | 3.15 GHz | 4.1 GHz | 3 TB | 300 | 256 MB | 6400 MT/s |
| EPYC9455 | 48 | 3.15 GHz | 4.4 GHz | 3 TB | 300 | 256 MB | 6400 MT/s |
| EPYC9375F | 32 | 3.85 GHz | 4.8 GHz | 3 TB | 320 | 256 MB | 6400 MT/s |
| EPYC9255 | 24 | 3.25 GHz | 4.3 GHz | 3 TB | 200 | 128 MB | 6400 MT/s |
| EPYC9365 | 36 | 3.4 GHz | 4.3 GHz | 3 TB | 300 | 192 MB | 6400 MT/s |
| EPYC9335 | 32 | 3 GHz | 4.4 GHz | 3 TB | 210 | 128 MB | 6400 MT/s |
| EPYC9275F | 24 | 4.1 GHz | 4.8 GHz | 3 TB | 320 | 256 MB | 6400 MT/s |
| EPYC9825 | 144 | 2.2 GHz | 3.7 GHz | 3 TB | 390 | 384 MB | 6400 MT/s |
| EPYC9645 | 96 | 2.3 GHz | 3.7 GHz | 3 TB | 320 | 256 MB | 6400 MT/s |
| EPYC9565 | 72 | 3.15 GHz | 4.3 GHz | 3 TB | 400 | 384 MB | 6400 MT/s |
| EPYC9175F | 16 | 4.2 GHz | 5 GHz | 3 TB | 320 | 512 MB | 6400 MT/s |
| EPYC9115 | 16 | 2.6 GHz | 4.4 GHz | 3 TB | 155 | 64 MB | 6400 MT/s |
| EPYC9015 | 8 | 3.6 GHz | 4.1 GHz | 3 TB | 125 | 64 MB | 6400 MT/s |
| 4th Gen AMD EPYC™ Processor | Cores | Base Frequency | Max Frequency | Max Memory | Default TDP (W) | Cache | Memory |
|---|---|---|---|---|---|---|---|
| EPYC 9754 | 128 | 2.25 GHz | 3.1 GHz | 3 TB | 360 | 256 MB | 4800 MT/s |
| EPYC 9734 | 112 | 2.2 GHz | 3.0 GHz | 3 TB | 340 | 256 MB | 4800 MT/s |
| EPYC 9654 | 96 | 2.4 GHz | 3.7 GHz | 3 TB | 360 | 384 MB | 4800 MT/s |
| EPYC 9654P | 96 | 2.4 GHz | 3.7 GHz | 3 TB | 360 | 384 MB | 4800 MT/s |
| EPYC 9634 | 84 | 2.25 GHz | 3.7 GHz | 3 TB | 290 | 384 MB | 4800 MT/s |
| EPYC 9554 | 64 | 3.1 GHz | 3.75 GHz | 3 TB | 360 | 256 MB | 4800 MT/s |
| EPYC 9554P | 64 | 3.1 GHz | 3.75 GHz | 3 TB | 320 | 256 MB | 4800 MT/s |
| EPYC 9534 | 64 | 2.45 GHz | 3.7 GHz | 3 TB | 280 | 256 MB | 4800 MT/s |
| EPYC 9454 | 48 | 2.75 GHz | 3.8 GHz | 3 TB | 290 | 256 MB | 4800 MT/s |
| EPYC 9454P | 48 | 2.75 GHz | 3.8 GHz | 3 TB | 290 | 256 MB | 4800 MT/s |
| EPYC 9474F | 48 | 3.6 GHz | 4.1 GHz | 3 TB | 360 | 256 MB | 4800 MT/s |
| EPYC 9374F | 32 | 3.85 GHz | 4.3 GHz | 3 TB | 320 | 256 MB | 4800 MT/s |
| EPYC 9354 | 32 | 3.25 GHz | 3.8 GHz | 3 TB | 280 | 256 MB | 4800 MT/s |
| EPYC 9354P | 32 | 3.25 GHz | 3.8 GHz | 3 TB | 280 | 256 MB | 4800 MT/s |
| EPYC 9334 | 32 | 2.7 GHz | 3.9 GHz | 3 TB | 210 | 128 MB | 4800 MT/s |
| EPYC 9224 | 24 | 2.5 GHz | 3.7 GHz | 3 TB | 200 | 192 MB | 4800 MT/s |
| EPYC 9254 | 24 | 2.9 GHz | 4.15 GHz | 3 TB | 200 | 128 MB | 4800 MT/s |
| EPYC 9274F | 24 | 4.05 GHz | 4.3 GHz | 3 TB | 320 | 128 MB | 4800 MT/s |
| EPYC 9174F | 16 | 4.1 GHz | 4.4 GHz | 3 TB | 320 | 256 MB | 4800 MT/s |
| EPYC 9124 | 16 | 3.0 GHz | 3.7 GHz | 3 TB | 200 | 128 MB | 4800 MT/s |
| EPYC 9684X | 96 | 2.55 GHz | 3.7 GHz | 3 TB | 400 | 1150 MB | 4800 MT/s |
| EPYC 9384X | 32 | 3.1 GHz | 3.1 GHz | 3 TB | 320 | 768 MB | 4800 MT/s |
| EPYC 9184X | 16 | 3.55 GHz | 3.55 GHz | 3 TB | 320 | 768 MB | 4800 MT/s |
| 5th Gen Intel® Xeon® Processor | Cores | Base Frequency | Max Frequency | Max Memory | Default TDP (W) | Cache | Memory |
|---|---|---|---|---|---|---|---|
| Xeon 8593Q | 64 | 2.2 GHz | 3.9 GHz | 2 TB | 385 | 320 MB | 5600 MT/s |
| Xeon 8592+ | 64 | 1.9 GHz | 3.9 GHz | 2 TB | 350 | 320 MB | 5600 MT/s |
| Xeon 8580 | 60 | 2 GHz | 4 GHz | 2 TB | 350 | 300 MB | 5600 MT/s |
| Xeon 8570 | 56 | 2.1 GHz | 4 GHz | 2 TB | 350 | 300 MB | 5600 MT/s |
| Xeon 8568Y+ | 48 | 2.3 GHz | 4 GHz | 2 TB | 350 | 300 MB | 5600 MT/s |
| Xeon 8562Y+ | 32 | 2.8 GHz | 4.1 GHz | 2 TB | 300 | 60 MB | 5600 MT/s |
| Xeon 8558 | 48 | 2.1 GHz | 4 GHz | 2 TB | 330 | 260 MB | 5200 MT/s |
| Xeon 8558U | 48 | 2 GHz | 4 GHz | 2 TB | 300 | 260 MB | 5200 MT/s |
| Xeon 6530 | 32 | 2.1 GHz | 4 GHz | 2 TB | 270 | 160 MB | 4800 MT/s |
| 4th Gen Intel® Xeon® Processor | Cores | Base Frequency | Max Frequency | Max Memory | Default TDP (W) | Cache | Memory |
|---|---|---|---|---|---|---|---|
| Xeon 9480 | 56 | 1.7 GHz | 1.9 GHz | 128 GB HBM | 350 | 112.5 MB | N/A |
| Xeon 9470 | 52 | 1.8 GHz | 2.0 GHz | 128 GB HBM | 350 | 105 MB | N/A |
| Xeon 9468 | 48 | 2.0 GHz | 2.1 GHz | 128 GB HBM | 350 | 105 MB | N/A |
| Xeon 9462 | 32 | 2.5 GHz | 2.7 GHz | 128 GB HBM | 350 | 75 MB | N/A |
| Xeon 9460 | 40 | 2.0 GHz | 2.2 GHz | 128 GB HBM | 350 | 97.5 MB | N/A |
| Xeon 8480+ | 56 | 2.0 GHz | 3.8 GHz | 2 TB | 350 | 105 MB | 4800 MT/s |
| Xeon 8470 | 52 | 2.0 GHz | 3.8 GHz | 2 TB | 350 | 105 MB | 4800 MT/s |
| Xeon 8470Q | 52 | 2.1 GHz | 3.8 GHz | 2 TB | 350 | 105 MB | 4800 MT/s |
| Xeon 8468 | 48 | 2.1 GHz | 3.8 GHz | 2 TB | 350 | 105 MB | 4800 MT/s |
| Xeon 8460Y+ | 40 | 2.0 GHz | 3.7 GHz | 2 TB | 300 | 105 MB | 4800 MT/s |
| Xeon 8452Y | 36 | 2.0 GHz | 3.2 GHz | 2 TB | 300 | 67.5 MB | 4800 MT/s |
| Xeon 6430 | 32 | 2.1 GHz | 3.4 GHz | 2 TB | 270 | 60 MB | 4800 MT/s |
| Xeon 8462Y+ | 32 | 2.8 GHz | 4.1 GHz | 2 TB | 300 | 60 MB | 4800 MT/s |
| Xeon 6448Y | 32 | 2.1 GHz | 4.1 GHz | 2 TB | 225 | 60 MB | 4800 MT/s |
| Xeon 6458Q | 32 | 3.1 GHz | 4.0 GHz | 2 TB | 350 | 60 MB | 4800 MT/s |
| Xeon 6438Y+ | 32 | 2.0 GHz | 4.0 GHz | 2 TB | 205 | 60 MB | 4800 MT/s |
| Xeon 5420+ | 28 | 2.0 GHz | 4.1 GHz | 2 TB | 205 | 52.5 MB | 4800 MT/s |
| Xeon 6442Y | 24 | 2.6 GHz | 4.0 GHz | 2 TB | 225 | 60 MB | 4800 MT/s |
| Xeon 5418Y | 24 | 2.0 GHz | 3.8 GHz | 2 TB | 185 | 45 MB | 4800 MT/s |
| Xeon 4416+ | 20 | 2.0 GHz | 3.9 GHz | 2 TB | 165 | 45 MB | 4800 MT/s |
| Xeon 6444Y | 16 | 3.6 GHz | 4.1 GHz | 2 TB | 270 | 45 MB | 4800 MT/s |
| Xeon 6426Y | 16 | 2.5 GHz | 4.1 GHz | 2 TB | 185 | 37.5 MB | 4800 MT/s |
| Xeon 4410Y | 12 | 2.0 GHz | 3.9 GHz | 2 TB | 150 | 30 MB | 4800 MT/s |
| Xeon 6434 | 8 | 3.7 GHz | 4.1 GHz | 2 TB | 195 | 22.5 MB | 4800 MT/s |
| Xeon 5415+ | 8 | 2.9 GHz | 4.1 GHz | 2 TB | 150 | 22.5 MB | 4800 MT/s |
On System Management Chipset
ASPEED 2600
Memory
Applicable to XD225v and XD295v.
| Type | DDR5 Registered (RDIMM) |
| DIMM slots available | 16 slots per server for XD220v 8 channels per processor, 1 DIMM per channel 24 slots per server for XD225v/XD295v 12 channels per processor, 1 DIMM per channel |
| Maximum capacity (RDIMM) | 2 TB for XD220v 16 x 128 GB at 5600 MT/s 3 TB for XD225v/XD295v 24 x 128 GB at 6400 MT/s |
Notes: Memory DIMM availability with a server platform is dependent upon completion of certification testing
Expansion Slots & Riser Information for XD220v/XD225v Server
| Low Profile Left Riser R1 (P49217-B21) | |||||
|---|---|---|---|---|---|
| Slots # | Technology | Bus Width | Connector Width | Slot Form Factor | Source |
| 1 | PCIe 5.0 | x16 | x16 | Low Profile | CPU1 |
| Low Profile Right Riser R2 (P49219-B21) | |||||
|---|---|---|---|---|---|
| Slots # | Technology | Bus Width | Connector Width | Slot Form Factor | Source |
| 2 | PCIe 5.0 | x16 | x16 | Low Profile | CPU1 |
Notes:
– If choosing Direct Liquid Cooling for the Cray XD2000 system, slot 2 is not available for use with a PCIe card
– Bus Width indicates the number of physical electrical lanes running to the connector
Expansion slots & riser information for XD295v server
| Low Profile P2 PCIe Riser R5 (P52200-B21) | |||||
|---|---|---|---|---|---|
| Slots # | Technology | Bus Width | Connector Width | Slot Form Factor | Source |
| 1 | PCIe 5.0 | x16 | x16 | Low Profile | CPU2 |
| Low Profile Right Riser R2 (P49219-B21) | |||||
|---|---|---|---|---|---|
| Slots # | Technology | Bus Width | Connector Width | Slot Form Factor | Source |
| 2 | PCIe 5.0 | x16 | x16 | Low Profile | CPU1 |
| 2U Right Riser R3 (P51613-B21), always selected under 2U Nodes | |||||
|---|---|---|---|---|---|
| Slots # | Technology | Bus Width | Connector Width | Slot Form Factor | Source |
| 3 | PCIe 5.0 | x16 | x16 | Low Profile Double Width, Full Height, Full Length | CPU2 |
| 2U Left Riser R4 (P51616-B21), always selected under 2U Nodes | |||||
|---|---|---|---|---|---|
| Slots # | Technology | Bus Width | Connector Width | Slot Form Factor | Source |
| 4 | PCIe 5.0 | x16 | x16 | Low Profile Double Width, Full Height, Full Length | CPU1 |
Notes: Bus Width indicates the number of physical electrical lanes running to the connector
Maximum Internal Storage Per Node | ||
|---|---|---|
| Drive | Capacity | Configuration |
| Hot Plug NVMe SSD (AMD) | 15 TB | 2x 7.68 TB |
Internal Storage Devices
Optional M.2 Mezz Riser Kit
Interfaces
| USB Ports | 1 USB 3.2 Gen1 Type A Port (external) |
| HPE Cray XD Management Network Port | Dedicated network management port |
| Health LED | 1 |
| Power | 1 |
| UID | 1 |
| Do not remove LED | 1 |
Industry Standard Compliance
- – ACPI 6.3 Compliant
- – PCIe 5.0 Compliant
- – WOL Support
- – Microsoft® Logo certifications
- – PXE Support
- – USB 3.0 Compliant (internal);
- – SMBIOS 3.4
- – UEFI 2.8
- – Redfish API
- – European Union ErP Lot 9 Regulation European Union (EU) eco-design regulations for server and storage products, known as Lot 9, establishes power thresholds for idle state, as well as efficiency and performance in active state which vary among configurations. HPE ProLiant Gen11 servers are compliant with Lot9 requirements. Please visit: https://www.HPE.com/us/en/about/environment/msds-specs-more.html for more information regarding HPE Lot 9 conformance.
- Beginning on January 1st, 2024, units sold into the European Union (EU), European Economic Area (EEA), the United Kingdom, or Switzerland must include more efficient AC power supplies: 94% for multi-output and 96% for single-output. HPE Flexible Slot power supplies are single-output, and part numbers 865438-B21, P03178-B21, and P44712-B21 are 96% efficient, thus meeting requirements.
- HPE is on target to fulfil compliant systems ahead of time and will begin enforcing these requirements in advance to satisfy requests with the current power supplies by the set deadline.
Power Specifications
To review typical system power ratings, please use the HPE Power Advisor Tool
For information on power specifications and technical content visit: https://www.HPE.com/info/qs
HPE Cray XD2000 Server UEFI
Unified Extensible Firmware Interface (UEFI) is an industry standard that provides better manageability and more secured configuration than the legacy ROM while interacting with your server at boot time.
The UEFI System utilities is embedded in the system ROM. Its features enable you to perform a wide range of configuration activities, including:
– Configuring system devices and installed options.
- – Enabling and disabling system features.
- – Displaying system information.
- – Selecting the primary boot controller or partition.
- – Configuring memory options.
- – Launching other preboot environments.
Cray XD2000 servers with UEFI can provide:
- – Secure Boot that enables the system firmware, option card firmware, operating systems, and software collaborate to enhance platform security.
- – An Embedded UEFI Shell that provides a preboot environment for running scripts and tools.
- – Boot support for option cards that only support a UEFI option ROM.
UEFI
Configure and boot your servers securely with industry standard Unified Extensible Firmware Interface (UEFI).
Learn more at: http://www.HPE.com/servers/uefi
Software Portfolio for HPE Cray XD2000s
Operating Systems and Virtualization Software Support for Cray XD2000 Servers
- – Windows Server 2022
- – Windows Server 2019
- – VMware ESXi 8
- – Red Hat Enterprise Linux (RHEL) 9.4, 8.9
- – SUSE Linux Enterprise Server (SLES) 15 SP5
- – Ubuntu (22.04,4 LTS)
Notes: For more information on Hewlett Packard Enterprise Certified and Supported Servers for OS and Virtualization Software and latest listing of software drivers available for your server.
https://www.HPE.com/us/en/servers/server-operating-systems.html
Fabric software
- – Mellanox UFM
Server Management
HPE Cray XD Baseboard Management Controller
Embedded, in-depth server-level monitoring and management technology offering system management, service alerting, reporting and remote management including remote console and virtual media mount.
Industry Standard Redfish
The Cray XD2000 supports industry standard DMTF Redfish that provide API conformance and offers simplified server management automation such as configuration and maintenance tasks based on modern industry standards. Learn more at: https://dmtf.org/standards/redfish.
For clustered HPE Cray XD2000 system deployments (for HPC or other emerging workloads such as AI), customers can use the following cluster management software solutions:
Enabling HPE Services Remote Support
- – Auto-case creation for hardware failures requires HPCM version 1.9 or higher. This feature identifies failures and creates support cases automatically, reducing downtime by starting repairs and parts ordering proactively.
- – Link to the configuration instructions: HPE Performance Cluster Manager Administration Guide
HPE Performance Cluster Manager
Fully integrated system management solution offering the capabilities you need to manage your HPE Linux®-based high performance computing (HPC) clusters.
HPE Performance Cluster Manager aggregates system metrics and remote management.
The software provides:
- – System setup
- – Hardware monitoring and management including GPU management
- – Image management and software updates
- – Power management
- – Integration with ISV & open source software solutions
- – AIOps capabilities
Software Development Tools (Programming languages, debuggers, libraries)
HPE Cray Supercomputing Programming Environment Software is a fully integrated software development suite offering programmers a comprehensive set of tools for developing, porting, debugging, and tuning their applications so that they can shorten application development time and accelerate their performance. CPE cannot be supported on Windows or Ubuntu OS.
Notes: For more information on HPE Cray Supercomputing Programming Environment Software click here
HPE Message Passing Interface (MPI) is an MPI development environment designed to enable the development and optimization of high-performance computing (HPC) applications. This software leverages a scalable MPI library and boosts performance of existing applications without requiring recompilation.
Additional 3rd party software development tools:
- – AMD AOCC
- – Intel® oneAPI
- – GNU Compiler Collection
- – Perforce® TotalView®
- – Mellanox HPC-X
Security
- – UEFI Secure Boot and Secure Start support
- – HPE Cray XD Hardware Root of Trust
- – Tamper-free updates – components digitally signed and verified
- – Secure Recovery – recover critical firmware to known good state on detection of compromised firmware
- – TPM (Trusted Platform Module) Module Kit option
- – HPE Cray XD2000 supports OpenSSL 3.0
- – Runtime Firmware Validation – Periodically scan essential firmware for compromised code during runtime
Liquid Cooling Overview
Liquid cooling provides effective cooling for the most powerful chips while they operate at their highest possible performance. It also provides very energy efficient cooling and enables higher rack densities.
Selecting DLC Options
HPE Cray XD2000 servers can be equipped with Direct Liquid Cooling (DLC) by selecting from the following options, in addition to normal server configuration menu options:
Notes: *highlighted options are specific to ARCS configurations only
| SKU Description | HPE SKU | Selection Criteria | Comments |
|---|---|---|---|
| HPE 42U 800 mm x 1200 mm Enterprise G2 Shock rack | P9K46A | One (1) per rack | DLC compatible 42U HPE racks |
| HPE 48U 800 mm x 1200 mm Enterprise G2 Shock rack | P9K58A | DLC compatible 48U HPE racks | |
| HPE ARCS 48U 800 mm x1600 mm Rack* | R8N95A | DLC compatible 48U HPE ARCS racks | |
| HPE Cray XD 75 kW 208 V FIO In-Rack Coolant Distribution Unit | P55832-B21 | One (1) per rack | 4U CDU mounted at the bottom of the rack |
| HPE Cray Fill and Drain FIO Hand Pump Kit | P59920-B21 | One (1) for multiple racks | Filling kit for CDU. One can be used to service multiple CDUs |
| HPE Cray 4U CDU 2.5 m FIO Leak Detection Kit | P55834-B21 | One (1) per rack | Additional external leak detection cable (is default but can be removed if not needed). Connects to rear of CDU and can be routed to desired location (CDU already contains internal leak detection) |
| HPE Cray G2 Rack 25.4 mm SAN to FD83 Secondary FIO Water Hose Kit | P56290-B21 | One (1) per rack | 1” inner diameter hose kit connects the CDU to the rack manifold in a standard HPE G2 rack |
| HPE Cray ARCS 25.4 mm SAN to FD83 Secondary FIO Water Hose Kit* | P56291-B21 | 1” inner diameter hose kit connects the CDU to the rack manifold in a HPE ARCS rack | |
| HPE Cray 25 mm 1.83 m Primary FIO Water Hose Kit with Insulation | P56286-B21 | One (1) per rack | 1” inner diameter insulated hose kit connects the CDU to the facility water piping below the rack |
| HPE Cray 25 mm 3.66 m Primary FIO Water Hose Kit with Insulation | P56287-B21 | 1” inner diameter Insulated hose kit connects the CDU to the facility water piping above the rack | |
| HPE Cray 38 mm 1.83 m Primary FIO Water Hose Kit | P59224-B21 | 1.5” inner diameter Non-insulated hose kit connects the CDU to the facility water piping below the rack | |
| HPE Cray 38 mm 3.66 m Primary FIO Water Hose Kit | P59225-B21 | 1.5” inner diameter Non-insulated hose kit connects the CDU to the facility water piping above the rack | |
| HPE Cray 42U 72-Node Direct Liquid Cooling FD83 SCG03 FIO Rack Manifold | P56288-B21 | One (1) per rack | 42U rack manifold with connections for 72 servers |
| HPE Cray 48U 84-Node Direct Liquid Cooling FD83 SCG03 FIO Rack Manifold | P56289-B21 | 48U rack manifold with connections for 84 servers | |
| HPE Cray XD2000 FIO Cooling Loop for AMD CPU | P56294-B21 | One (1) per server | DLC coldplate loop for AMD CPU cooling |
| HPE Cray XD2000 DDR5 FIO Cooling Loop for AMD CPU | P56295-B21 | DLC coldplate loop for AMD CPU & Memory cooling | |
| HPE Cray XD2000 FIO Cooling Loop for Intel CPU | P56292-B21 | DLC coldplate loop for Intel CPU cooling | |
| HPE Cray XD2000 DDR5 FIO Cooling Loop for Intel CPU | P56293-B21 | DLC coldplate loop for Intel CPU & Memory cooling |
HPE Adaptive Rack Cooling System (ARCS)
HPE ARCS can provide advanced cooling for HPE Cray XD2000 servers using facility water.
HPE ARCS is a liquid to air heat exchanger cooling system that wraps around HPE racks to provide cool inlet air and manage warm exhaust air. This option can be used for air cooled HPE Cray XD2000 racks or in combination with DLC to cool high density racks.
For additional information, please visit HPE Adaptive Rack Cooling System QuickSpecs here.
HPE Rear Door Heat Exchanger (RDHX)
HPE RDHX can neutralize warm exhaust air from HPE Cray XD2000 servers using facility water.
HPE RDHX is a liquid to air heat exchanger cooling system that is mounted directly to the rear panel of HPE racks. This option can be used for air cooled HPE Cray XD2000 racks or in combination with HPE Cray XD2000 DLC to cool high density racks.
For additional information, please visit HPE Motivair Liquid Cooled Doors QuickSpecs here.
Service and Support
Configuration Information
For the most up-to-date information on HPE Services, please refer to the HPE Services – Supplemental QuickSpecs, which provides a comprehensive and regularly updated overview of available services.
Step 1: Choose a Chassis | SKU |
| HPE Cray v2240 Configure-to-order Chassis | P49953-B21 |
| Notes: – HPE Cray v2240 is the default chassis for Cray XD2000 – P49954-B21 (v2277 CTO Chassis) is available if 277Volt power supplies are needed | |
| Choose a Backplane for Chassis | SKU |
| HPE Cray XD2000 4SFF U.2 FIO Backplane Kit | P51772-B21 |
| Notes: – One qty of P51773-B21 (power cable kit) and one qty of P51774-B21 (chassis cable kit) need to be selected. – For driveless configuration with no backplanes, two qty of P51776-B21 (drive cage blank) need to be selected. | |
| Power Supplies | SKU |
| HPE DPS-2400AB-10 2400 W 240VAC Common Redundant Power Supply Kit | P48778-B21 |
| HPE 2400 W 240 V Titanium Common Redundant Power Supply Kit | P53914-B21 |
| Notes: – P48778-B21 can be selected with v2240 chassis only – For 1 Node, Minimum 1 PSU; For 2 Nodes, Min 2 PSUs; For 3 Nodes, Min 2 PSUs, For 4 Nodes, Min 3 PSUs. – PSU blank (P48748-B21) will be added to PSU slots not populated – For v2277 chassis, P48780-B21 1600 W CRPS is available | |
| Power Cords | SKU |
| HPE C19 - C20 WW 250 V 16Amp 2.5 m Jumper Cord | 295633-B22 |
| HPE C19-C20 IN 250 V 16Amp 2.5 m Black Jumper Cord | R1C66A |
| HPE C20 to 2xC19 240 V 16Amp 3 m FIO Splitter Power Cord | S2C02A |
| Notes: Quantity must be equal to total number of power supplies on the order. For v2277 chassis, use P52178-B21 Jumper cord. | |
Step 2: Choose Air Cooling Options | |
| HPE Air Cooling Options | SKU |
| HPE Cray Supercomputing XD2000 Server Node Blank Kit | P48749-B21 |
| Notes: Required for any non-populated slots in the chassis for designed thermal performance, including system operation and Node servicing | |
Step 3: Choose the following rail kit and bracket per chassis | |
| HPE Rail Kits | SKU |
| HPE Cray XD2000 Rail Kit | P49240-B21 |
| Notes: Hewlett Packard Enterprise recommends that a minimum of two people are required for all rack installations. Please refer to your installation instructions for proper tools and number of people to use for any installation | |
Step 4: Choose Base configuration | |
| Server Trays | SKU |
| HPE Cray XD200v 1U Node Configure-to-order Server | P49000-B21 |
| HPE Cray XD225v 1U Node Configure-to-order Server | P52183-B21 |
| HPE Cray XD295v 2U Node Configure-to-order Server | P52184-B21 |
| Notes: – Up to 4 single 1U half width server trays (XD225v) can be added to the HPE Cray v2240 Chassis – Up to 2 single 2U half width server trays (XD295v) or 2 single 1U half width servers with a single 2U half width servers – Mixing of AMD and Intel Nodes is not allowed | |
Step 5: Choose Processor option | |
| Notes: Certain limitations may apply to select processors, please contact your HPE sales representative | |
| Intel Processors – Factory Integrated Processor Kit for XD220v | SKU |
| Intel Xeon-Platinum 8593Q 2.2 GHz 64-core 385 W Processor Kit for HPE Cray XD | P70089-B21 |
| Intel Xeon-Platinum 8592+ 1.9 GHz 64-core 350 W Processor Kit for HPE Cray XD | P70090-B21 |
| Intel Xeon-Platinum 8580 2.0 GHz 60-core 350 W Processor Kit for HPE Cray XD | P70088-B21 |
| Intel Xeon-Platinum 8570 2.1 GHz 56-core 350 W Processor Kit for HPE Cray XD | P70087-B21 |
| Intel Xeon-Platinum 8568Y+ 2.3 GHz 48-core 350 W Processor Kit for HPE Cray XD | P70086-B21 |
| Intel Xeon-Platinum 8562Y+ 2.8 GHz 32-core 300 W Processor Kit for HPE Cray XD | P71376-B21 |
| Intel Xeon-Platinum 8558 2.1 GHz 48-core 330 W Processor Kit for HPE Cray XD | P70085-B21 |
| Intel Xeon-Platinum 8558U 2.0 GHz 48-core 300 W Processor Kit for HPE Cray XD | P70084-B21 |
| Intel Xeon-Gold 6530 2.1 GHz 32-core 270 W Processor Kit for HPE Cray XD | P70083-B21 |
| Intel Xeon-Platinum 9480 1.9 GHz 56-core 350 W Processor Kit for HPE Cray XD | P62691-B21 |
| Intel Xeon-Platinum 8468 2.1 GHz 48-core 350 W Processor Kit for HPE Cray XD | P56399-B21 |
| Intel Xeon-Platinum 8452Y 2.0 GHz 36-core 300 W Processor Kit for HPE Cray XD | P56408-B21 |
| Notes: – "HPE Cray XD220v CPU 1 Rear FIO Heat Sink Kit" (P49855-B21) must be ordered for 1st Processor. – "HPE Cray XD220v CPU 2 Front Heat Sink Kit" (P49854-B21) must be ordered for 2nd Processor. | |
| AMD Processors – Factory Integrated Processor Kit for XD225v and XD295v | SKU |
| AMD EPYC 9655 2.6 GHz 96-core 400 W Processor for HPE | P73357-B21 |
| AMD EPYC 9555 3.2 GHz 64-core 360 W Processor for HPE | P73360-B21 |
| AMD EPYC 9355 3.6 GHz 32-core 280 W Processor for HPE | P73364-B21 |
| AMD EPYC 9135 3.7 GHz 16-core 200 W Processor for HPE | P73367-B21 |
| AMD EPYC 9655P 2.6 GHz 96-core 400 W Processor for HPE | P73369-B21 |
| AMD EPYC 9555P 3.2 GHz 64-core 360 W Processor for HPE | P73370-B21 |
| AMD EPYC 9355P 3.6 GHz 32-core 280 W Processor for HPE | P73372-B21 |
| AMD EPYC 9575F 3.0 GHz 64-core 320 W Processor for HPE | P73377-B21 |
| AMD EPYC 9845 2.1 GHz 160-core 390 W Processor for HPE | P73353-B21 |
| AMD EPYC 9745 2.4 GHz 128-core 400 W Processor for HPE | P73355-B21 |
| AMD EPYC 9535 2.4 GHz 64-core 300 W Processor for HPE | P73359-B21 |
| AMD EPYC 9475F 3.65 GHz 48-core 360 W Processor for HPE | P73373-B21 |
| AMD EPYC 9455P 3.15 GHz 48-core 300 W Processor for HPE | P73371-B21 |
| AMD EPYC 9455 3.15 GHz 48-core 300 W Processor for HPE | P73361-B21 |
| AMD EPYC 9375F 3.85 GHz 32-core 320 W Processor for HPE | P73374-B21 |
| AMD EPYC 9255 3.25 GHz 24-core 200 W Processor for HPE | P73365-B21 |
| AMD EPYC 9365 3.4 GHz 36-core 300 W Processor for HPE | P73362-B21 |
| AMD EPYC 9335 3.0 GHz 32-core 210 W Processor for HPE | P73363-B21 |
| AMD EPYC 9275F 4.1 GHz 24-core 320 W Processor for HPE | P73375-B21 |
| AMD EPYC 9825 2.2 GHz 144-core 400 W Processor for HPE | P73354-B21 |
| AMD EPYC 9645 2.3 GHz 96-core 320 W Processor for HPE | P73356-B21 |
| AMD EPYC 9565 3.15 GHz 72-core 400 W Processor for HPE | P73358-B21 |
| AMD EPYC 9175F 4.2 GHz 16-core 320 W Processor for HPE | P73376-B21 |
| AMD EPYC 9115 2.6 GHz 16-core 155 W Processor for HPE | P73366-B21 |
| AMD EPYC 9015 3.6 GHz 8-core 155 W Processor for HPE | P73368-B21 |
| AMD EPYC 9754 2.25 GHz 128-core 360 W Processor Kit for HPE Cray XD2X5v | P61723-B21 |
| AMD EPYC 9734 2.2 GHz 112-core 340 W Processor Kit for HPE Cray XD2X5v | P61722-B21 |
| AMD EPYC 9654 2.4 GHz 96-core 360 W Processor Kit for HPE Cray XD2X5v | P56456-B21 |
| AMD EPYC 9654P 2.4 GHz 96-core 360 W Processor Kit for HPE Cray XD2X5v | P56457-B21 |
| AMD EPYC 9174F 4.1 GHz 16-core 320 W Processor Kit for HPE Cray XD2X5v | P56458-B21 |
| AMD EPYC 9534 2.45 GHz 64-core 280 W Processor Kit for HPE Cray XD2X5v | P56459-B21 |
| AMD EPYC 9554 3.1 GHz 64-core 360 W Processor Kit for HPE Cray XD2X5v | P56460-B21 |
| AMD EPYC 9354 3.25 GHz 32-core 280 W Processor Kit for HPE Cray XD2X5v | P56461-B21 |
| AMD EPYC 9124 3 GHz 16-core 200 W Processor Kit for HPE Cray XD2X5v | P56462-B21 |
| AMD EPYC 9554P 3.1 GHz 64-core 360 W Processor Kit for HPE Cray XD2X5v | P56463-B21 |
| AMD EPYC 9354P 3.25 GHz 32-core 280 W Processor Kit for HPE Cray XD2X5v | P56464-B21 |
| AMD EPYC 9634 2.25 GHz 84-core 290 W Processor Kit for HPE Cray XD2X5v | P56465-B21 |
| AMD EPYC 9474F 3.6 GHz 48-core 360 W Processor Kit for HPE Cray XD2X5v | P56466-B21 |
| AMD EPYC 9254 2.9 GHz 24-core 200 W Processor Kit for HPE Cray XD2X5v | P56467-B21 |
| AMD EPYC 9454 2.75 GHz 48-core 290 W Processor Kit for HPE Cray XD2X5v | P56468-B21 |
| AMD EPYC 9454P 2.75 GHz 48-core 290 W Processor Kit for HPE Cray XD2X5v | P56469-B21 |
| AMD EPYC 9374F 3.85 GHz 32-core 320 W Processor Kit for HPE Cray XD2X5v | P56470-B21 |
| AMD EPYC 9274F 4.05 GHz 24-core 320 W Processor Kit for HPE Cray XD2X5v | P56471-B21 |
| AMD EPYC 9334 2.7 GHz 32-core 210 W Processor Kit for HPE Cray XD2X5v | P56472-B21 |
| AMD EPYC 9224 2.5 GHz 24-core 200 W Processor Kit for HPE Cray XD2X5v | P58782-B21 |
| AMD EPYC 9684X 2.55 GHz 96-core 400 W Processor Kit for HPE Cray XD2X5v | P63468-B21 |
| AMD EPYC 9384X 3.1 GHz 32-core 320 W Processor Kit for HPE Cray XD2X5v | P63467-B21 |
| AMD EPYC 9184X 3.55 GHz 16-core 320 W Processor Kit for HPE Cray XD2X5v | P63466-B21 |
| Notes: – P type processors are 1P socket count ONLY. Cannot be mixed with any other processor. – "HPE Cray XD2X5v CPU 1 Rear FIO Heat Sink Kit" (P52187-B21) must be ordered for 1st Processor. – "HPE Cray XD2X5v CPU 2 Front Heat Sink Kit" (P52185-B21) must be ordered for 2nd Processor. | |
Step 6: Choose Additional Options from Core and Additional Options sections below | |
| HPE Cray XD2000 Memory Notes: – Minimum 1 DIMMs are required per server; up to 8 DIMMs per processor. – A maximum of 16 DIMMs are supported per XD220v server tray (or 8 DIMMs max per processor). – For 4th Generation CPUs, select 4800 MT/s DIMM(s). For 5th Generation CPUs, select 5600 MT/s DIMM(s) – No mixing of x4 and x8 memory allowed – To maximize performance in most potential applications, it is recommended to balance the total memory capacity across all installed processors. Load the channels similarly whenever possible to enable optimal interleaving. – HPE memory from previous generation servers is not compatible with this server. | |
| Registered DIMMs for XD220v | SKU |
| HPE Cray Supercomputing XD 16 GB (1x16GB) Single Rank x8 DDR5-5600 Registered Standard Memory Kit | P70075-H21 |
| HPE Cray Supercomputing XD 32 GB (1x32GB) Dual Rank x8 DDR5-5600 Registered Standard Memory Kit | P70077-H21 |
| HPE Cray Supercomputing XD 64 GB (1x64GB) Dual Rank x4 DDR5-5600 Registered Standard Memory Kit | P70079-H21 |
| HPE Cray XD 16 GB (1x16GB) Single Rank x8 DDR5-4800 Registered Standard Memory Kit | P46966-H21 |
| HPE Cray XD 32 GB (1x32GB) Dual Rank x8 DDR5-4800 Registered Standard Memory Kit | P46968-H21 |
| HPE Cray XD 64 GB (1x64GB) Dual Rank x4 DDR5-4800 Registered Standard Memory Kit | P46970-H21 |
| Registered DIMMs for XD225v/XD295v | SKU |
| HPE 16 GB (1x16GB) Single Rank x8 DDR5-6400 CAS-46-45-45 Registered Standard Memory Kit | P70132-H21 |
| HPE 32 GB (1x32GB) Dual Rank x8 DDR5-6400 CAS-46-45-45 Registered Standard Memory Kit | P70134-H21 |
| HPE 64 GB (1x64GB) Dual Rank x4 DDR5-6400 CAS-46-45-45 Registered Standard Memory Kit | P70136-H21 |
| HPE Cray XD 96 GB (1x96GB) Dual Rank x4 DDR5-6400 Registered Standard Memory Kit | P77970-H21 |
| HPE 128 GB (1x128GB) Dual Rank x4 DDR5-6400 CAS-46-45-45 EC8 Registered Standard Memory Kit | P70138-H21 |
| HPE Cray XD 16 GB (1x16GB) Single Rank x8 DDR5-4800 Registered Standard Memory Kit | P58354-H21 |
| HPE Cray XD 32 GB (1x32GB) Dual Rank x8 DDR5-4800 Registered Standard Memory Kit | P58356-H21 |
| HPE Cray XD 64 GB (1x64GB) Dual Rank x4 DDR5-4800 Registered Standard Memory Kit | P58358-H21 |
HPE PCIe riser kits | |
| All 1U Server Node Compatible – HPE XD22xv | SKU |
| HPE Cray XD2X5v Low Profile Left Riser Kit | P49217-B21 |
| HPE Cray XD2000 Low Profile Right Riser Kit | P49219-B21 |
| HPE Cray XD2000 M.2 Mezzanine Kit | P49242-B21 |
| Notes: – If DLC option is chosen, Right Riser kit cannot be ordered – Riser does not take up a PCIe slot in the system – Max qty is 1 per Node for above riser kits and Mezzanine kit | |
| HPE XD295v Exclusive | SKU |
| HPE Cray XD2000 P2 PCIe Riser Kit | P52200-B21 |
| Notes: – P51613-B21 and P51616-B21 Risers are automatically selected with XD295v server – Max qty is 1 per Node for above riser kits | |
| Graphic Card Options | SKU |
| NVIDIA L40S 48 GB PCIe Accelerator | S2L70A |
| Notes: GPU require enablement kits. See Graphic Card Accessories notes section for more details | |
| Graphic Card Accessories | SKU |
| HPE Cray XD2000 L40S/H100 Enablement Kit | P68889-B21 |
Step 7: Choose Additional Factory Integrated Options (only one from each category unless otherwise noted) | |
| HPE Networking | |
| Ethernet Options | SKU |
| Intel E810-XXVDA2 Ethernet 10/25 GB 2-port SFP28 Adapter for HPE | P08443-B21 |
| Intel E810-XXVDA4 Ethernet 10/25 GB 4-port SFP28 Adapter for HPE | P08458-B21 |
| Intel I350-T4 Ethernet 1 GB 4-port BASE-T Adapter for HPE | P21106-B21 |
| Intel E810-CQDA2 Ethernet 100 GB 2-port QSFP28 Adapter for HPE | P21112-B21 |
| Mellanox MCX623106AS-CDAT Ethernet 100 GB 2-port QSFP56 Adapter for HPE | P25960-B21 |
| HPE Slingshot SA210S Ethernet 200 GB 1-port PCIe NIC | R4K46A |
| Intel I350-T4 Ethernet 1 GB 4-port BASE-T OCP3 Adapter for HPE | P08449-B21 |
| Broadcom BCM57416 Ethernet 10 GB 2-port BASE-T OCP3 Adapter for HPE | P10097-B21 |
| Intel E810-XXVDA2 Ethernet 10/25 GB 2-port SFP28 OCP3 Adapter for HPE | P10106-B21 |
| Intel E810-CQDA2 Ethernet 100 GB 2-port QSFP28 OCP3 Adapter for HPE | P22767-B21 |
| Notes: – For 1U, total Slots available for PCIe is 2, total Slots available for OCP3.0 is 1. This is a total selection from anything in the following categories: InfiniBand, Networking, Controllers, PCI Accelerator – Requires the selection of Left or Right Riser kit | |
| InfiniBand Options | SKU |
| HPE InfiniBand NDR 1-port OSFP PCIe5 x16 MCX75310AAS-NEAT Adapter | P45641-H21 |
| HPE InfiniBand NDR200/Ethernet 200 GbE 2-port QSFP112 PCIe5 x16 MCX755106AC-HEAT Adapter | P65333-H21 |
| HPE InfiniBand NDR/Ethernet 400G QSFP112 MPO12 850nm Multi-mode 50 m APC Transceiver | P65334-B21 |
| HPE InfiniBand NDR/Ethernet 400 GB 1-port OSFP PCIe5 x16 MCX75310AAS-NEAT Adapter | P45641-H23 |
| HPE InfiniBand NDR/Ethernet 400 GB 1-port OSFP PCIe5 x16 MCX75310AAS-NEAT Adapter | P45641-H24 |
| Notes: – Requires the selection of Left or Right Riser kit. Maximum PCIe card limit is depending on the selection of Left and/ or Right riser kit – Please see the QuickSpecs for Technical Specifications and additional information: – https://buy.HPE.com/us/en/options/adapters/c/c001004 | |
| HPE XD225v and XD295v Exclusive | SKU |
| HPE Data Processing Unit InfiniBand NDR/Ethernet 400 GB 1-port QSFP112 HHHL B3140H Adapter | P66387-H21 |
| HPE Cray XD2000 Drives | SKU |
| Notes: The XD2000 platform does not support key management, but SEDs are offered to customers that are willing to use third party solutions to manage the keys | |
| Samsung PM9A3 960 GB NVMe Read Intensive SFF U.2 Self-encrypting SSD for HPE Cray XD 2000 | P48414-H21 |
| Samsung PM9A3 1.92 TB NVMe Read Intensive SFF U.2 Self-encrypting SSD for HPE Cray XD 2000 | P55285-H21 |
| Samsung PM9A3 3.84 TB NVMe Read Intensive SFF U.2 Self-encrypting SSD for HPE Cray XD 2000 | P48411-H21 |
| Samsung PM9A3 7.68 TB NVMe Read Intensive SFF U.2 Self-encrypting SSD for HPE Cray XD 2000 | P55175-H21 |
| Samsung PM9A3 960 GB PCIe Gen4 Mixed Use M.2 22110 Self-encrypting SSD for HPE Cray XD 2000 | P48695-H21 |
| Samsung PM9A3 1.92 TB PCIe Gen4 Mixed Use M.2 22110 Self-encrypting SSD for HPE Cray XD 2000 | P48701-H21 |
| Samsung PM9A3 3.84 TB PCIe Gen4 Mixed Use M.2 22110 Self-encrypting SSD for HPE Cray XD 2000 | P55178-H21 |
| Micron 7450 960 GB NVMe Gen4 Read Intensive M.2 22110 SSD for HPE Cray XD | P60528-H21 |
| Micron 7450 1.92 TB NVMe Gen4 Read Intensive M.2 22110 SSD for HPE Cray XD | P60529-H21 |
| Micron 7450 3.84 TB NVMe Gen4 Read Intensive M.2 22110 SSD for HPE Cray XD | P60530-H21 |
| Micron 7500 PRO 960 GB NVMe Read Intensive SFF U.3 SSD for HPE Cray XD 2000 | P72437-H21 |
| Micron 7500 PRO 1.92 TB NVMe Read Intensive SFF U.3 SSD for HPE Cray XD 2000 | P72438-H21 |
| Micron 7500 PRO 3.84 TB NVMe Read Intensive SFF U.3 SSD for HPE Cray XD 2000 | P72439-H21 |
| Micron 7500 PRO 7.68 TB NVMe Read Intensive SFF U.3 SSD for HPE Cray XD 2000 | P72440-H21 |
| Micron 7500 PRO 15.36 TB NVMe Read Intensive SFF U.3 SSD for HPE Cray XD 2000 | P72441-H21 |
| Micron 7500 MAX 1.6 TB NVMe Mixed Use SFF U.3 SSD for HPE Cray XD 2000 | P72442-H21 |
| Micron 7500 MAX 3.2 TB NVMe Mixed Use SFF U.3 SSD for HPE Cray XD 2000 | P72443-H21 |
HPE Performance Cluster Manager | |
| For additional information, please visit HPE Performance Cluster Manager QuickSpecs here | SKU |
| HPE Performance Cluster Manager 1 Node 3yr 24x7 Support Perpetual E-LTU | Q9V60AAE |
| Notes: – One license per Node – Includes three years of support – This is an electronic license – This is a perpetual license. The Software will continue working even when the support term ends | |
| HPE Performance Cluster Manager 1 Node 3yr 24x7 Support Perpetual LTU | Q9V60A |
| Notes: – One license per Node. – Includes three years of support. – This is a perpetual license. The software will continue working even when the support term ends. | |
| HPE Performance Cluster Manager FIO Software | Q9V61A |
| Notes: – This SKU does not include the license. Please order with Q9V60AAE. – Order one per Node | |
| HPE Performance Cluster Manager Media Kit | Q9V62A |
| Notes: One media kit per solution. | |
HPE Power Distribution UnitsPower Distribution Units (PDUs) are an integral piece to this data center solution and HPE offers several types. Basic PDUs provide reliable power with 0U or 1U installation options. Metered PDUs have added intelligence to precisely track power usage and switched PDUs provide both local and remote power management. There are additional metered PDUs that are recommended for this solution that are not part of the mainstream PDU product offering. They are as follows: | |
| | SKU |
| HPE Switched 3-phase 66.5kVA/60309 5-wire 100A/277 V 21-breaker Vertical NA PDU | R8P19A |
| HPE Metered 3Ph 66.5kVA/60309 100A 5-wire 480/277 V Outlets (21) SDG23/Vertical NA PDU | 879034-B21 |
| HPE Metered 3Ph 39.9kVA/60309 60A 5-wire 480/277 V Outlets (21) SDG23/Vertical NA PDU | 880459-B21 |
| HPE Metered 3Ph 57.6kVA/60309 100A 5-wire 80A/230 V Outlets (3) C13 (18) C19/Vertical NA PDU | 880460-B21 |
| HPE Metered 3Ph 34.5kVA/60309 60A 5-wire 48A/230 V Outlets (3) C13 (18) C19/Vertical NA FIO PDU | 880461-B21 |
| HPE Cray Supercomputer 60A 415 V 3 Phase 24 CX PDU | R4N30A |
| HPE Mtrd 3P 69.1kVA 125A 96A230V FIO PDU | 880462-B21 |
| HPE Metered 3Ph 45.1kVA/60309 63A 5-wire 63A/230 V Outlets (3) C13 (18) C19/Vertical INTL FIO PDU | 880463-B21 |
| HPE Cray Supercomputer 63A 400 V 3 Phase 24 CX PDU | R4N29A |
Technical Specifications
HPE Cray v2240/v2277 Chassis | ||
|---|---|---|
| Dimensions | Height | 3.44 in (8.75 cm) |
| Width | 17.63 in (44.8 cm) | |
| Depth | 38.43 in (91.6 cm) | |
| Shipping Dimensions | Height | 12.5 in (31.75 cm) |
| Width | 23.63 in (60 cm) | |
| Depth | 39.37 in (100 cm) | |
| Chassis Weight | Empty (no drives, power supplies, RCM,server Nodes and server blanks) | 27.47 lbs. (12.46 kg) |
| Max Enclosure Weight | Approximate – 24 SFF drive configuration | 106.50 lbs. (48.3 kg) |
HPE Cray XD220v/XD225v Server Node | ||
|---|---|---|
| Server Dimensions (H x W x D) | 1.62 x 8.33 x 27.2 in (4.125 cm x 21.150 cm x 69.09 cm) | |
| Weight (approximate) | Minimum | 13.12 lbs. (5.95 kg) |
| Maximum | 16.31 lbs. (7.40 kg) | |
HPE Cray XD295v Server Node | ||
|---|---|---|
| Server Dimensions (H x W x D) | 3.26 x 8.33 x 27.80 in (8.272 cm x 21.150 cm x 70.602 cm) | |
| Weight (approximate) | Minimum | 21.30 lbs. (9.66 kg) |
| Maximum | 29.37 lbs. (13.32 kg) | |
| System Inlet Temperature Standard Operating Support | 10° to 35°C (50° to 95°F) | At sea level with an altitude derating of 1.0°C per every 305 m (1.8°F per every 1000 ft) above sea level to a maximum of 3050 m (10,000 ft), no direct sustained sunlight. Maximum rate of change is 20°C/hr (36°F/hr). The upper limit and rate of change may be limited by the type and number of options installed. |
| Extended Ambient Operating Support | 10° to 5°C (50° to 41°F) and 35° to 40°C (95° to 104°F) | System performance during standard operating support may be reduced if operating with a fan fault or above 30°C (86°F). For approved hardware configurations, the supported system inlet range is extended to be: 5° to 10°C (41° to 50°F) and 35° to 40°C (95° to 104°F) at sea level with an altitude derating of 1.0°C per every 175 m (1.8°F per every 574 ft) above 900 m (2953 ft) to a maximum of 3050 m (10,000 ft). The approved hardware configurations for this system are listed at the URL: http://www.HPE.com/servers/ashrae For approved hardware configurations, the supported system inlet range is extended to be: 40° to 45°C (104° to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3050 m (10,000 ft). The approved hardware configurations for this system are listed at the URL :http://www.HPE.com/servers/ashrae |
| -30° o 60°C (-22° to 140°F). | Maximum rate of change is 20°C/hr (36°F/hr). | |
| Relative Humidity (non-condensing)Operating | 8% to 90% | Relative humidity (Rh), 28°C maximum wet bulb temperature, non-condensing. |
| Non-operating | 5 to 95% | Relative humidity (Rh), 38.7°C (101.7°F) maximum wet bulb temperature, non-condensing. |
| Altitude Operating | 3050 m (10,000 ft). | This value may be limited by the type and number of options installed. Maximum allowable altitude change rate is 457 m/min (1500 ft/min). |
| Non-operating | 9144 m (30,000 ft). | Maximum allowable altitude change rate is 457 m/min (1500 ft/min). |
Thermal limitations
For a full list of thermal limitations please see the HPE Cray XD2xxv thermal guidelines.
https://www.HPE.com/support/xd220v-thermal
TCO Certified
Environmental-friendly Products and Approach – End-of-life Management and Recycling
Hewlett Packard Enterprise offers end-of-life product return, trade-in, and recycling programs, in many geographic areas, for our products. Products returned to Hewlett Packard Enterprise will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE Directive (2012/19/EU) requires manufacturers to provide treatment information for each product type for use by treatment facilities.
These instructions may be used by recyclers and other WEEE treatment facilities as well as Hewlett Packard Enterprise OEM customers who integrate and re-sell Hewlett Packard Enterprise equipment.
TCO Certified
TCO Certified The HPE ProLiant XL225n servers has been TCO Certified. All HPE TCO Certified products can be found on TCO Certified Product Finder. More information on TCO Certified can be downloaded here: https://www.HPE.com/us/en/about/environment/eco-labels.html
Summary of Changes
| Date | Version History | Action | Description of Change |
|---|---|---|---|
| 04-May-2026 | Added |
| |
| Changed |
| ||
| Removed |
| ||
| 02-Feb-2026 | Changed | Visual rebranding | |
| 23-Jun-2025 | Changed | Turin memory support on QS was updated to 6400 MT/s | |
| Removed | Obsolete SKUs were removed P51613-B21,P51616-B21 | ||
| 03-Mar-2025 | Changed | Standard Features section was updated. | |
| 06-Jan-2025 | Changed | Configuration Information Section was updated Obsolete SKU was removed | |
| 02-Dec-2024 | Changed | Overview, Standard Features and configuration Information sections were updated | |
| 07-Oct-2024 | Changed | Standard Features and configuration Information sections were updated | |
| 03-Sep-2024 | Changed | Configuration Information Section was updated Obsolete SKU was removed | |
| 15-Jul-2024 | Changed | Standard Features section was updated | |
| 03-Jun-2024 | Changed | Standard Features section was updated | |
| 06-May-2024 | Changed | Overview, Standard Features, Configuration Information, Technical Specifications sections were updated Series name was updated | |
| 01-Apr-2024 | Changed | Configuration Information Section was updated | |
| 08-Jan-2024 | Changed | Configuration Information Section was updated | |
| 04-Dec-2023 | Changed | Overview and Configuration Information sections were updated. | |
| 06-Nov-2023 | Changed | Configuration Information Section was updated | |
| 02-Oct-2023 | Changed | Overview section was updated. | |
| 05-Sep-2023 | Changed | Configuration Information Section was updated | |
| 07-Aug-2023 | Changed | Standard Features section was updated. | |
| 05-Jun-2023 | Changed | Standard Features and configuration Information sections were updated | |
| 01-May-2023 | Changed | Standard Features and configuration Information sections were updated | |
| 03-Apr-2023 | Changed | Configuration Information Section was updated | |
| 06-Mar-2023 | Changed | Overview, Standard Features, Configuration Information, Technical Specifications sections were updated | |
| 06-Feb-2023 | Changed | Standard Features and Configuration information sections were Updated | |
| 10-Jan-2023 | Changed | Configuration Information Section was updated | |
| 05-Dec-2022 | Changed | Standard Features & Technical Specifications Sections were updated | |
| 10-Nov-2022 | New | New QuickSpecs |
© Copyright 2026 Hewlett Packard Enterprise Development LP. The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft and Windows NT are US registered trademarks of Microsoft Corporation.
Intel, the Intel logo, Xeon and Xeon Inside are trademarks of Intel Corporation in the U.S. and other countries.
AMD Opteron™ is a US registered trademark of AMD Corporation.
a50004301enw, - 16905 - Worldwide - V26 - 04-May-2026