HPE at
Mobile World Congress
March 2–5, 2026
Fira Gran Via, Barcelona
Hall 3, Booth 3N10
Secure, AI-native infrastructure.
Purpose-built for AI with AI.
Visit us at Hall 3, Booth 3N10.
Join us at Mobile World Congress 2026 and meet with leading experts ready to help you realize secure, AI-native infrastructure at scale. For the first time, HPE and Juniper Networks will take the global stage together to showcase how our unified portfolio is redefining the future of networking in the AI era.
Discover how we’re helping organizations like yours:
- Modernize telco and service provider networks with scalable, AIOps-driven infrastructure.
- Accelerate data center AI workloads and boost performance with the cutting-edge networking solutions.
- Transform enterprise IT network customer experiences with secure, AI-native networking solutions.
- Enable carrier-grade security that scales to protect users, data, and applications everywhere.
HPE Executives and
Experts at MWC
Want to learn how industry leaders are using the latest network innovations to tackle their biggest business problems? Meet with HPE executives and technical subject matter experts on-site to learn how our solutions are driving transformations for businesses of all sizes.
Antonio Neri
President & Chief Executive Officer
Mark Bakker
Executive Vice President & General Manager, Operations
Maeve Culloty
Executive Vice President, President & CEO, HPE Financial Services
Phil Mottram
Executive Vice President & Chief Sales Officer
Rami Rahim
Executive Vice President, President & General Manager, Networking
Alain Carpentier
Senior Vice President & Head of Worldwide Sales, HPE Networking
Phil Cutrone
Senior Vice President & General Manager, Service Providers, OEM Solutions, and Telco Infrastructure
David Stark
Vice President & General Manager, Telco Solutions
Contact your HPE account representative to schedule a meeting with our executives or subject matter experts today.
Hands-on demos
Through dozens of live demos, experience first-hand our secure AI-native infrastructure solutions designed for sustainability with AI-native routing. Learn how to accelerate your AI workloads with cutting-edge data center solutions.
Get to know our comprehensive client-to-cloud portfolio, unified under one platform from the leader in wired, Wi-Fi, private 5G, and WAN—and explore a broad range of security solutions that help you secure the telco infrastructure and beyond. More details coming soon!
Thanks to HPE’s Mobile World Congress 2026 sponsors
Intel
From the edge to the core network to the cloud, Intel® solutions provide a common foundation for critical telecommunications use cases. By supporting open standards and advanced enterprise software, Intel helps operators reduce vendor lock‑in while improving flexibility and total cost of ownership. Built‑in AI optimizations and Intel® Xeon® processors accelerate 5G and AI workloads, boosting network efficiency and enabling new revenue opportunities. Through deep collaboration with industry partners and alliances such as O‑RAN, Intel drives scalable innovation and advances the adoption of open, AI‑enabled networks.
AMD
AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world’s most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing.
KIOXIA
KIOXIA Europe GmbH is the European based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems.